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About Us:
Microelectronic & Photonics Bonding Specialists

Davies & Bell Ltd. are a Micro Electronic Assembly Company.

We offer Engineering Consultancy to the Micro Electronic Back End Packaging Industry. This covers Equipment (New and Used / Refurbed), Process Development, Materials, Tooling / Jig Design and Training.

We are an Independent Bonding Consultancy. This means we can work with any OEM and Rep Company. 

At Davies & Bell we pride ourselves in providing smart Die & Wire Bonding Solutions for challenging applications, from Prototype all the way to Volume Production. This enables us to collaborate with other key Micro Electronic Companies to offer a more comprehensive, higher capability solution to our customers. We believe this will be a catalyst to push innovation within the sector. 

Our Capability:

Below you will find just a few of the technical capabilities that Davies & Bell are currently able to offer:

  • Eutectic, Epoxy & Pressure-less Sinter Die Bonding

  • UV Passive Lens & Optics Bonding

  • Flip Chip, COB and PCB Assembly

  • Ball & Wedge Bonding

  • Dam & Fill, Under Fill and Encapsulation

  • Vacuum Reflow Die Bond & Lidding

  • Bonding Measurement and Verification

  • Xray, SEM, VMM, Destruct and Non-Destruct Bond Testing

As a business, we pride ourselves in being able to offer solutions to customers' problems. If the capability you are looking for isn't listed then please get in touch and we will find ways of helping.

Our Markets:


Davies & Bell have supported customers in a variety of different sectors. These include:

  • Photonics

  • Telecoms, Datacoms, Laser, LED, Solar

  • Aerospace & Defence

  • Automotive

  • Medical / Bio Medical

  • Industrial Power Modules

  • Electric Vehicles

  • IoT & Smart Cities

  • RF & HP Sensors

The capability of our processes and equipment enables us to help micro electronics clients in many other markets. Please get in touch to discuss how we can help. 

Our Cluster:


Davies & Bell Ltd. were one of the first tenants to relocate their business to the £8M Electronics & Photonics Innovation Centre (EPIC) in Torbay (South West, England UK).

This facility offers us access to some state-of-the-art equipment including:

  • Scanning Electron Microscope (SEM)

  • Bond Tester

  • Visual Measurement System (VMS)

  • Plasma Cleaning

Furthermore, Davies & Bell is able to assemble products in a class 7 classified clean room environment. 

The location of our facility enables us to be an active member in a vibrant electronics and photonics cluster located in the area. 

It is called the Torbay High Tech Cluster - THTC

In January 2023, we moved out of epic into our own Industrial Unit in Torbay Business Park, just down the road from epic. After 3 years being incubated nicely by epic, we finally had to spread our wings and take on a larger space to fit our business model going forward. 


"Davies & Bell are proud to be part of the vibrant and active TORBAY HI-TECH CLUSTER. The cluster meets regularly at EPIC to collaborate on innovative projects to push the sector forward. As an SME, having access and the chance to work with Multi National companies like Lumentum, Coherent II-VI, Gooch & Housego and Effect Photonics is highly valuable in the growth of our business."

Martyn Davies - Director

Latest News:

Our new Facility

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Company Registration Number:  07256708 

Davies & Bell Ltd. | Unit E5  | Torbay Business Park  | Western Bowl  | Woodview Road  | Paignton  | Devon  | TQ4 7HP  | UK

Tel: + 44 (0) 7904 208374

email:  or

Latest Used Equipment For Sale!
GPD Global Micro Max Dispenser    Esec 3100 Optima Ball Bonder
Esec CT2000 Tile Bonder                Palomar CBT 6000 Ball Bonder
Esec Micron 2 Epoxy Die Bonder      Palomar 2460 Ball Bonder
Datacon PPM 2200 - Single Module  Palomar 2470 Wedge Bonder
Datacon APM 2200 - Dual Module    Tresky & EDB80 Manual Die Bonders

Questar Ball Bonder                        Fein Focus X-Ray 

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